ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,072, issued on July 14, was assigned to Kulicke and Soffa Hi-Tech Co. Ltd. (New Tapei City, Taiwan). "Working station systems for dispensin... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,073, issued on July 14, was assigned to SEMES Co. LTD. (Chungcheongnam-Do, South Korea). "Auto teaching apparatus including test substrate ... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,074, issued on July 14, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Apparatus, systems, and methods of measuring edge ri... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,075, issued on July 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Method for mapping wafers in a wafe... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,076, issued on July 14, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Pressure puck diagnostic wafer" was invented by Kost... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,077, issued on July 14, was assigned to GUDENG PRECISION INDUSTRIAL Co. LTD. (New Taipei City, Taiwan). "Reticle pod having anti-collision ... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,078, issued on July 14, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Semiconductor process equipment" was invented by Bha... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,079, issued on July 14, was assigned to Persimmon Technologies Corp. (Wakefield, Mass.). "Modular material handling robot platform" was inv... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,080, issued on July 14, was assigned to Semes Co. Ltd (Cheonan-si, South Korea). "OHT management system and control method for OHT manageme... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,081, issued on July 14, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan). "Method for transporting wafers" was... Read More